Title:
THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF THERMOSETTING RESIN COMPOSITION, AND SOLDER RESIST FORMED FROM THERMOSETTING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/190221
Kind Code:
A1
Abstract:
Provided is a thermosetting resin composition capable of reducing the dielectric loss tangent while having high permittivity. A thermosetting resin composition containing (A) an epoxy compound, (B) a compound having a maleimide group, (C) an inorganic filler, and (D) a thermosetting catalyst, the (C) inorganic filler containing (C1) metal oxide particles, and the (C1) metal oxide particles constituting 50-90 mass% inclusive of the solids fraction of the thermosetting resin composition.
Inventors:
EINISHI HIRO (JP)
ARIMA KATSUYA (JP)
HORI ATSUSHI (JP)
OKUMURA RYOYA (JP)
ARIMA KATSUYA (JP)
HORI ATSUSHI (JP)
OKUMURA RYOYA (JP)
Application Number:
PCT/JP2023/011959
Publication Date:
October 05, 2023
Filing Date:
March 24, 2023
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK (JP)
International Classes:
C08K3/22; C08G59/40; C08K5/3415; C08L63/00; H05K3/28
Domestic Patent References:
| WO2018003590A1 | 2018-01-04 |
Foreign References:
| CN102643543A | 2012-08-22 | |||
| JP2021187969A | 2021-12-13 |
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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