Title:
THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/223912
Kind Code:
A1
Abstract:
The present disclosure provides a thermosetting resin composition from which a cured product having high toughness is obtained and which has resin particles that hardly absorb moisture. The present disclosure is a thermosetting resin composition containing a thermosetting resin and resin particles, wherein the resin particles contain a polyamide resin and a polyolefin resin, and the content of the polyamide resin in the resin particles is at least 50 wt%.
Inventors:
MUTSUDA MITSUTERU (JP)
NAKAIE YOSHIKI (JP)
FUJIKI DAISUKE (JP)
NAKAIE YOSHIKI (JP)
FUJIKI DAISUKE (JP)
Application Number:
PCT/JP2023/017570
Publication Date:
November 23, 2023
Filing Date:
May 10, 2023
Export Citation:
Assignee:
POLYPLASTICS EVONIK CORP (JP)
International Classes:
C08L101/00; C08L23/00; C08L63/00; C08L77/00
Domestic Patent References:
| WO2013122008A1 | 2013-08-22 | |||
| WO2018016138A1 | 2018-01-25 |
Foreign References:
| JP2015163692A | 2015-09-10 | |||
| JP2007191631A | 2007-08-02 | |||
| JP2009019131A | 2009-01-29 | |||
| JP2012162673A | 2012-08-30 |
Attorney, Agent or Firm:
ARCO PATENT & TRADEMARK ATTORNEYS (JP)
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