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Title:
THERMOSETTING RESIN COMPOSITION, DIELECTRIC FILM, INTERLAYER DIELECTRIC FILM, MULTILAYER WIRING BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/103082
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide a thermosetting resin composition which is excellent in terms of heat resistance, reliability concerning moisture resistance, and moisture-absorption reflow characteristics. The thermosetting resin composition is characterized by comprising (A) a thermosetting resin having an unsaturated double bond at an end, (B) a silica filler surface-treated with a specific long-chain spacer type silane coupling agent including an alkyl group having an unsaturated double bond at at least an end, and (C) a flexibility-imparting resin (excluding component (A)). It is preferable that the unsaturated double bond of component (B) be a vinyl group.

Inventors:
KUROKAWA Tsuyoshi (3993, Nigorikawa Kita-ku, Niigata-sh, Niigata 31, 〒9503131, JP)
SATO Junya (3993, Nigorikawa Kita-ku, Niigata-sh, Niigata 31, 〒9503131, JP)
YOSHIDA Masaki (3993, Nigorikawa Kita-ku, Niigata-sh, Niigata 31, 〒9503131, JP)
TERAKI Shin (3993, Nigorikawa Kita-ku, Niigata-sh, Niigata 31, 〒9503131, JP)
Application Number:
JP2018/043120
Publication Date:
May 31, 2019
Filing Date:
November 22, 2018
Export Citation:
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Assignee:
NAMICS CORPORATION (3993, Nigorikawa Kita-ku, Niigata-sh, Niigata 31, 〒9503131, JP)
International Classes:
C08F290/06; C08K3/36; C08K5/5425; C08L53/02; C08L71/12; H05K1/03
Foreign References:
JP2017009715A2017-01-12
JP2010111758A2010-05-20
JP2013241515A2013-12-05
Attorney, Agent or Firm:
WATARAI Yusuke (3048-9, Kamihongou Matsudo-sh, Chiba 64, 〒2710064, JP)
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