Title:
THERMOSETTING RESIN COMPOSITION, DIELECTRIC FILM, INTERLAYER DIELECTRIC FILM, MULTILAYER WIRING BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/103082
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide a thermosetting resin composition which is excellent in terms of heat resistance, reliability concerning moisture resistance, and moisture-absorption reflow characteristics.
The thermosetting resin composition is characterized by comprising (A) a thermosetting resin having an unsaturated double bond at an end, (B) a silica filler surface-treated with a specific long-chain spacer type silane coupling agent including an alkyl group having an unsaturated double bond at at least an end, and (C) a flexibility-imparting resin (excluding component (A)). It is preferable that the unsaturated double bond of component (B) be a vinyl group.
Inventors:
KUROKAWA TSUYOSHI (JP)
SATO JUNYA (JP)
YOSHIDA MASAKI (JP)
TERAKI SHIN (JP)
SATO JUNYA (JP)
YOSHIDA MASAKI (JP)
TERAKI SHIN (JP)
Application Number:
PCT/JP2018/043120
Publication Date:
May 31, 2019
Filing Date:
November 22, 2018
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08F290/06; C08K3/36; C08K5/5425; C08L53/02; C08L71/12; H05K1/03
Foreign References:
| JP2017009715A | 2017-01-12 | |||
| JP2010111758A | 2010-05-20 | |||
| JP2013241515A | 2013-12-05 |
Attorney, Agent or Firm:
WATARAI Yusuke (JP)
Download PDF: