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Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION AND ELECTRIC APPLIANCE USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/184963
Kind Code:
A1
Abstract:
Provided are a convenient thermosetting resin composition having excellent fracture toughness in addition to dimensional stability and heat resistance, and an electric appliance using the same. The thermosetting resin composition pertaining to the present invention is characterized by having a first component containing a polymer compound that has functional groups, and a second component containing a compound that produces a crosslinking reaction with the first component, the first component and/or the second component containing a monomer that has functional groups and has an [n] catenane structure (where n is 2 or greater) in at least part of the component material, and the two components reacting with each other to bring about curing.

Inventors:
KAGAWA Hiroyuki (HITACHI LTD., 1-1, Omika-cho 7-chome, Hitachi-sh, Ibaraki 92, 〒3191292, JP)
HOJO Fusao (HITACHI LTD., 1-1, Omika-cho 7-chome, Hitachi-sh, Ibaraki 92, 〒3191292, JP)
Application Number:
JP2013/063857
Publication Date:
November 20, 2014
Filing Date:
May 17, 2013
Export Citation:
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Assignee:
HITACHI, LTD. (6-6 Marunouchi 1-chome, Chiyoda-ku Tokyo, 80, 〒1008280, JP)
International Classes:
C08L101/00; C08F283/01; C08G59/00; C08G85/00; C08L61/04
Foreign References:
JP2011105946A2011-06-02
JP2012188523A2012-10-04
JP2012516917A2012-07-26
Attorney, Agent or Firm:
ISONO Michizo (Sabo Kaikan Annex 7-4, Hirakawa-cho 2-chome, Chiyoda-k, Tokyo 93, 〒1020093, JP)
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