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Title:
THERMOSETTING RESIN COMPOSITION, FILM CONTAINING SAME, AND MULTILAYER WIRING BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/230531
Kind Code:
A1
Abstract:
Provided are: a film; and a thermosetting resin composition used in the production of the film. This film has excellent adhesive strength with respect to a substrate material and a metal foil which forms the wiring of a printed circuit board. Furthermore, this film exhibits excellent electrical properties in a high-frequency region. Specifically, this film exhibits a low dielectric constant (ε) and a low dielectric loss tangent (tan δ) in the frequency range of 1-100 GHz. Moreover, this film can be cured at lower temperatures. The thermosetting resin composition used in the production of the film contains (A) a thermosetting resin having a styrene group at the end, (B) a styrene-based thermoplastic elastomer, (C) a sulfide-based silane coupling agent, and (D) a dialkyl peroxide-based radical polymerization initiator.

Inventors:
KUROKAWA Tsuyoshi (3993 Nigorikawa, Kita-ku, Niigata-sh, Niigata 31, 〒9503131, JP)
YOSHIDA Masaki (3993 Nigorikawa, Kita-ku, Niigata-sh, Niigata 31, 〒9503131, JP)
TERAKI Shin (3993 Nigorikawa, Kita-ku, Niigata-sh, Niigata 31, 〒9503131, JP)
Application Number:
JP2019/020331
Publication Date:
December 05, 2019
Filing Date:
May 22, 2019
Export Citation:
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Assignee:
NAMICS CORPORATION (3993, Nigorikawa Kita-ku, Niigata-sh, Niigata 31, 〒9503131, JP)
International Classes:
C08F299/02; C08J5/18; C08K5/14; C08K5/548; C08L53/02; C08L71/12; H05K1/03; H05K3/28; H05K3/46
Domestic Patent References:
WO2014148155A12014-09-25
WO2014024678A12014-02-13
Foreign References:
JP2017031276A2017-02-09
JP2016089137A2016-05-23
JP2010111758A2010-05-20
JP2017502109A2017-01-19
JP2009179730A2009-08-13
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (7th Floor, HULIC Nakano Bldg. 44-18 Honcho 4-chome, Nakano-k, Tokyo 12, 〒1640012, JP)
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