THERMOSETTING RESIN COMPOSITION, RESIN FILM FOR INTERLAYER INSULATION, COMPOSITE FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

WIPO Patent Application WO/2019/146797

A1

Provided is a thermosetting resin composition which, as a thermosetting resin composition that can be used as a composite film for electronic devices using high frequency band signals, has a high glass transition temperature, excellent embedding properties with respect to unevenness in a circuit, etc., excellent dielectric characteristics as well as low thermal expansion, and also has good handling properties (that is, when the thermosetting resin composition has been B staged, said thermosetting resin composition is flexible, and in addition, when said thermosetting resin composition is made into a film, cracks do not easily occur even if the same is bent, and the thermosetting resin composition is easy to peel from a protective film.) Further provided is a resin film for interlayer insulation in which the thermosetting resin composition is used, a composite film, a printed wiring board, and a semiconductor package. Specifically, the thermosetting resin composition comprises a polyimide compound (A) which has: a structural unit derived from a maleimide compound (a1) having at least two N-substituted maleimide groups; and a structural unit derived from an amine compound (a2) having a total carbon number of 3-13.

KASAHARA AYA (JP)
IWAKURA TETSUROU (JP)
SHOJI YUKAKO (JP)
TSUCHIKAWA SHINJI (JP)

PCT/JP2019/002962

August 01, 2019

January 29, 2019

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HITACHI CHEMICAL CO LTD (JP)

C08G73/12; B32B27/34; C08K3/013; C08K5/14; C08L9/00; C08L79/00; H05K1/03

JPS4935488A	1974-04-02
JP2018012776A	2018-01-25
JPS4843674B1	1973-12-20
JPH03265630A	1991-11-26
JPH04202323A	1992-07-23
JPH10101796A	1998-04-21
JPS4637735B1
JP2006241300A	2006-09-14

OHTANI PATENT OFFICE (JP)

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