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Title:
THERMOSETTING RESIN COMPOSITION FOR HIGH FREQUENCY HAVING LOW DIELECTRIC LOSS, PREPREG USING SAME, AND COPPER CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2015/088245
Kind Code:
A1
Abstract:
The present invention provides a non-epoxy based thermosetting resin composition for high frequency, containing: (a) a polyphenylene ether resin having two or more unsaturated substituents at both terminals of a molecule chain or an oligomer thereof, the unsaturated substituents being selected from the group consisting of a vinyl group and an allyl group; and (b) a cross-linkable setting agent, a prepreg comprising the composition, and a printed circuit board. The present invention can provide a printed circuit board for high frequency which simultaneously exhibits excellent low-dielectric loss, favorable moisture absorption and heat resistance, low-thermal expansion, and thermal stability.

Inventors:
JUNG, Dong Hee (18-1, Naedong-ro 50beon-gil Gyuam-myeon,Buyeo-gun, Chungcheongnam-do 323-813, 323-813, KR)
HAN, Duk Sang (1388 Dongseo-daero,Jung-gu, Daejeon 301-782, 301-782, KR)
KWON, Jeong Don (24 Jinsan-ro,Suji-gu, Yongin-si, Gyeonggi-do 448-748, 448-748, KR)
KIM, Moo Hyun (1309-803, 21 Dongcheon-ro 135beon-gil,Suji-gu, Yongin-si, Gyeonggi-do 448-913, 448-913, KR)
HONG, Do Woong (101-301, 16 Suji-ro 113beon-gil,Suji-gu, Yongin-si, Gyeonggi-do 448-982, 448-982, KR)
Application Number:
KR2014/012142
Publication Date:
June 18, 2015
Filing Date:
December 10, 2014
Export Citation:
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Assignee:
DOOSAN CORPORATION (275Jangchungdan-ro, Jung-gu, Seoul 100-730, 100-730, KR)
International Classes:
C08L71/12; B32B15/08; C08G65/40; C08J5/24
Foreign References:
JP2006516297A2006-06-29
KR100835782B12008-06-09
KR100835783B12008-06-09
KR20010114177A
Attorney, Agent or Firm:
HANBEOT PATENT & LAW FIRM (15th Fl. Salvation Army Bldg, 7 Chungjeong-ro,,Seodaemun-gu, Seoul 120-013, 120-013, KR)
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