THERMOSETTING RESIN COMPOSITION, INTERLAYER INSULATING RESIN FILM, COMPOSITE FILM, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE

WIPO Patent Application WO/2019/146105

A1

Provided is a thermosetting resin composition that can be formed into a composite film for use in an electronic device that uses high-frequency bandwidth signals. The thermosetting resin composition has a high glass transition temperature, exhibits excellent properties for embedding into uneven surfaces of a circuit or the like, has both good dielectric characteristics and low thermal expansion, and exhibits good handleability (that is, the thermosetting resin composition has flexibility when B-staged, and a film formed therefrom is less likely to develop cracks when bent, and less likely to be separated from a cover film.) Also provided are an interlayer insulating resin film, composite film, printed circuit board, and semiconductor package that use the thermosetting resin composition. More specifically, the thermosetting resin composition contains a polyimide compound (A) having a structural unit derived from a maleimide compound (a1) having at least two N-substituted maleimide groups and a structural unit derived from an amine compound (a2) having a carbon-carbon double bond.

KASAHARA AYA (JP)
IWAKURA TETSUROU (JP)
SHOJI YUKAKO (JP)
TSUCHIKAWA SHINJI (JP)

PCT/JP2018/002715

August 01, 2019

January 29, 2018

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HITACHI CHEMICAL CO LTD (JP)

C08L79/08; C08G73/10; C08K3/00; C08K5/14; H01L23/14; H05K3/46

JP2009149742A	2009-07-09
JPS4935488A	1974-04-02
JPH0267363A	1990-03-07
JP2012180482A	2012-09-20
JP2016135859A	2016-07-28

HIRASAWA, Kenichi et al. (JP)

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