THERMOSETTING RESIN COMPOSITION AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2016/056619

A1

[Problem] To obtain a thermosetting resin composition with which the occurrence of voids, when treated under the increasing temperature conditions required for underfilling in a semiconductor chip thermal compression bonding step using a thermal compression bonding construction method, is limited and which is capable of being used as underfill for obtaining good solder connections. [Solution] A thermosetting resin composition comprising a thermosetting resin, a curing agent and a flux agent. For the resin composition, the temperature at which the viscosity temperature change rate reaches 30 Pa∙sec/°C when temperature is increased with a prescribed temperature increase profile is 200-250°C.

WO/1981/001857	CHEMICAL RESISTANT COATINGS
WO/2023/140644	MODIFIED EPOXY RESIN FOR SEMICONDUCTOR DEVICE ENCAPSULATION, METHOD FOR MANUFACTURING SAME, AND LIQUID RESIN COMPOSITION FOR SEMICONDUCTOR DEVICE ENCAPSULATION EXHIBITING LOW WARPAGE CONTAINING SAME
WO/2014/107300	BLENDS OF POLYSULFONES AND POLYPHENYLENE SULFIDES

HOSHIYAMA MASAAKI (JP)
HOTCHI TOYOKAZU (JP)
ENOMOTO TOSHIAKI (JP)

PCT/JP2015/078580

April 14, 2016

October 08, 2015

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NAMICS CORP (JP)

C08L63/04; C08F2/44; C08K5/3437; C08L33/06; C08L101/00; C09J11/06; C09J163/00; H01L21/60; H01L23/29; H01L23/31

WO2010052871A1	2010-05-14
WO2011048774A1	2011-04-28
WO2011033743A1	2011-03-24
WO2008004287A1	2008-01-10

JP2015137299A	2015-07-30
JP2012238702A	2012-12-06
JP2015168691A	2015-09-28
JP2013171927A	2013-09-02
JPH05337999A	1993-12-21
JP2014211363A	2014-11-13

TSUKUNI & ASSOCIATES et al. (JP)
Patent business corporation Tsukuni (JP)

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