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Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/088122
Kind Code:
A1
Abstract:
The present invention provides a resin composition that demonstrates, when being cured, excellent toughness and heat resistance and that provides, as a resin composition, excellent handleability. The present invention pertains to a thermosetting resin composition that comprises: an allylic compound (A) having at least one benzene ring and at least two allyl groups per molecule; a maleimide compound (B) that has at least two maleimide groups per molecule; a thiol compound (C) that has at least two thiol groups per molecule; and a cyclic compound (D) that has at least two hydroxyl groups per molecule.

Inventors:
KIDA HIROMI (JP)
MIYATA ATSUSHI (JP)
IKESHITA SHINJI (JP)
KOBAYASHI KEITA (JP)
Application Number:
PCT/JP2018/040382
Publication Date:
May 09, 2019
Filing Date:
October 30, 2018
Export Citation:
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Assignee:
SAKAI CHEMICAL INDUSTRY CO (JP)
International Classes:
C08G75/045; C08G59/40; C08J3/20; C08K5/13; C08L81/02
Foreign References:
JP2016074902A2016-05-12
JPS5816232A1983-01-29
US20100063184A12010-03-11
JP2011084711A2011-04-28
Other References:
OHTSUKA, KEIKO ET AL.: "Novel bismaleimide/diallylbisphenol A resin modified with multifunctional thiol containing isocyanuric ring and long-chain aliphatic unit", HIGH PERFORMANCE POLYMERS, vol. 28, no. 5, 2016, pages 591 - 599, ISSN: 0954-0083
FAN, SHILIANG ET AL.: "The application of thiol-ene reaction on preparing UV curable bismaleimide-containing liquid formulations", EUROPEAN POLYMER JOURNAL, vol. 44, no. 7, 2008, pages 2123 - 2129, XP022853371, ISSN: 0014-3057, DOI: doi:10.1016/j.eurpolymj.2008.04.024
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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