THERMOSETTING RESIN COMPOSITION, ORGANOSILICON COMPOUND, MOLDED BODY, AND OPTICAL SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2022/239271

A1

Provided are: a thermosetting resin composition from which a molded body exhibiting little change in optical characteristics when exposed to high temperatures can be obtained, and which can be applied to various packaging processes; an organosilicon compound from which said composition can be achieved; and a molded body and an optical semiconductor device which are obtained using such a thermosetting resin composition.　This thermosetting resin composition contains: a compound that is selected from among organosilicon compounds (A) represented by formula (1-1) or formula (1-2); an organosilicon compound (B) that has a plurality of crosslinkable groups in the molecule and is other than the organosilicon compounds (A); and a hydrosilylation catalyst (C). The organosilicon compound (B) includes a compound that is crosslinkable with the organosilicon compounds (A). In formula (1-1) and formula (1-2), each n is independently an average value satisfying 1