Title:
THERMOSETTING RESIN COMPOSITION, PHOTOCURABLE RESIN COMPOSITION, CURED PRODUCT AND HEAT RESISTANCE IMPROVING AGENT
Document Type and Number:
WIPO Patent Application WO/2018/110550
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a thermosetting resin composition or a photocurable resin composition, which enables the achievement of a cured product that has excellent mechanical strength and excellent heat resistance. A thermosetting resin composition which contains (A) an epoxy resin having an average number of epoxy groups of 2 or more, (B) a silsesquioxane derivative which has a weight average molecular weight Mw of from 2,000 to 10,000 (inclusive), while containing RSiO3/2 groups as repeating constituent units, and wherein from 50% by mole to 100% by mole (inclusive) of all the repeating constituent units contained in each molecule are essential repeating constituent units wherein R is an organic group containing a glycidyl group and from 0% by mole to 50% by mole (inclusive) of all the repeating constituent units contained in each molecule are optional repeating constituent units wherein R is an aryl group and/or an alkyl group having 1 to 12 carbon atoms (inclusive), and (C) an amine compound having two or more amino groups which are reactive with the epoxy groups. From 5 parts by weight to 30 parts by weight (inclusive) of the silsesquioxane derivative (B) is contained per 100 parts by weight of the epoxy resin (A).
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Inventors:
KANAYA SHINGO
Application Number:
PCT/JP2017/044570
Publication Date:
June 21, 2018
Filing Date:
December 12, 2017
Export Citation:
Assignee:
NAGASE CHEMTEX CORP (JP)
International Classes:
C08G59/20; C08G59/50
Foreign References:
| JP2013504684A | 2013-02-07 | |||
| JP2005338790A | 2005-12-08 | |||
| JP2012116989A | 2012-06-21 |
Attorney, Agent or Firm:
PATENT CORPORATE BODY ARCO PATENT OFFICE (JP)
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