Title:
THERMOSETTING RESIN COMPOSITION, PREPREG CONTAINING SAME, LAMINATED BOARD, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2017/097000
Kind Code:
A1
Abstract:
A thermosetting resin composition. The composition comprises thermosetting resin, a cross-linking agent, accelerator, and a porogen. The porogen is a porogen capable of being dissolved in an organic solvent. The organic solvent is an organic solvent capable of dissolving the thermosetting resin. A mode of directly adding the dissolvable porogen to a resin system is used, tiny pores that are uniform in pore diameter can be evenly distributed in resin matrix by means of a simple process at low cost, and the high-performance composition having a low dielectric constant and low dielectric loss is obtained; the method has good applicability to a great number of resin systems; because the pore size in the system reaches a nanometer grade, performance of the final system, such as mechanical strength, thermal performance and water absorption rate, is not sacrificed.
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Inventors:
CHEN WENXIN (CN)
DU CUIMING (CN)
CHAI SONGGANG (CN)
DU CUIMING (CN)
CHAI SONGGANG (CN)
Application Number:
PCT/CN2016/099122
Publication Date:
June 15, 2017
Filing Date:
September 14, 2016
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L63/00; B32B15/092; B32B15/20; B32B27/04; C08J5/24; C08J9/10; C08J9/28; C08L61/06; H05K1/03
Foreign References:
| CN1626578A | 2005-06-15 | |||
| CN104497483A | 2015-04-08 | |||
| CN103450639A | 2013-12-18 | |||
| CN105348744A | 2016-02-24 | |||
| CN103992620A | 2014-08-20 | |||
| JP2002283526A | 2002-10-03 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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