Title:
THERMOSETTING RESIN COMPOSITION, PREPREG CONTAINING SAME, METAL FOIL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2020/155291
Kind Code:
A1
Abstract:
Provided by the present invention are a thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bismaleimide resin and a benzoxazine resin or a prepolymer of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester. A metal foil-clad laminate prepared by using the resin composition provided by the present invention has a high glass transition temperature, a low thermal expansion coefficient, a high high-temperature modulus, a high peel strength, a low dielectric constant, a low dielectric loss factor, as well as good heat resistance and good processability.
Inventors:
CHEN ZHENWEN (CN)
Application Number:
PCT/CN2019/077162
Publication Date:
August 06, 2020
Filing Date:
March 06, 2019
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
B32B15/08; C08L79/08; B32B15/092; B32B27/08; B32B27/20; B32B27/28; B32B27/38; C08J5/24; C08K5/12; C08L61/34; C08L63/00; H05K1/03
Foreign References:
| CN109265654A | 2019-01-25 | |||
| CN109233244A | 2019-01-18 | |||
| CN104725781A | 2015-06-24 | |||
| CN104845363A | 2015-08-19 | |||
| CN107459650A | 2017-12-12 |
Other References:
See also references of EP 3919566A4
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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