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Title:
THERMOSETTING RESIN COMPOSITION, PREPREG AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/170844
Kind Code:
A1
Abstract:
Provided is a thermosetting resin composition which can be molded at relatively low temperatures, and which exhibits excellent heat resistance, mechanical strength, toughness and thermal decomposition properties after curing. This thermosetting resin composition contains: a compound (A) represented by formula (1) and having a maleimide group; and a compound (B) having an allyl group or a methallyl group. (In formula (1), each of the plurality of R1 moieties is independently present and represents a hydrogen atom, an alkyl group having 1-10 carbon atoms or an aromatic group; a represents a number of 1-3; and n represents an integer having an average satisfying 1 < n ≤ 5.)

Inventors:
MATSUURA Kazuki (3-31-12 Shimo, Kita-k, Tokyo 88, 〒1158588, JP)
NAKANISHI Masataka (3-31-12 Shimo, Kita-k, Tokyo 88, 〒1158588, JP)
FUJITA Tomoki (3-31-12 Shimo, Kita-k, Tokyo 88, 〒1158588, JP)
Application Number:
JP2017/013196
Publication Date:
October 05, 2017
Filing Date:
March 30, 2017
Export Citation:
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Assignee:
NIPPON KAYAKU KABUSHIKI KAISHA (1-1 Marunouchi 2-chome, Chiyoda-ku Tokyo, 05, 〒1000005, JP)
International Classes:
C08L65/00; C08F22/40; C08G61/02
Domestic Patent References:
WO2014123051A12014-08-14
WO2015152007A12015-10-08
Foreign References:
JP2009001783A2009-01-08
JPH06192361A1994-07-12
JP2000053750A2000-02-22
JPH07228546A1995-08-29
JP2016023195A2016-02-08
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (Toranomon East Bldg. 8F, 7-13 Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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