Title:
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2016/175325
Kind Code:
A1
Abstract:
Provided are: a thermosetting resin composition which exhibits particularly good compatibility, while having good dielectric characteristics (low dielectric constant and low dielectric loss tangent) in a high frequency band, high adhesiveness to a conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy; a prepreg using this thermosetting resin composition; a laminate; and a multilayer printed wiring board. The thermosetting resin composition specifically contains: (A) a polyphenylene ether derivative that has an N-substituted maleimide structure-containing group and a structural unit represented by general formula (I) in each molecule; (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds; and (C) a phosphorus flame retardant.
(In the formula, each R1 independently represents an aliphatic hydrocarbon group having 1-5 carbon atoms, or a halogen atom; and x represents an integer of 0-4.)
Inventors:
TANIGAWA TAKAO (JP)
MIZUNO YASUYUKI (JP)
FUKUDA TOMIO (JP)
NAGAI YUKI (JP)
MURAI HIKARI (JP)
MIZUNO YASUYUKI (JP)
FUKUDA TOMIO (JP)
NAGAI YUKI (JP)
MURAI HIKARI (JP)
Application Number:
PCT/JP2016/063497
Publication Date:
November 03, 2016
Filing Date:
April 28, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L71/12; B32B27/00; C08G65/333; C08J5/24; C08K5/51; C08L63/00; C08L79/04
Foreign References:
| JP2010018791A | 2010-01-28 | |||
| JP2001302900A | 2001-10-31 | |||
| JP2003292767A | 2003-10-15 | |||
| JP2010138364A | 2010-06-24 | |||
| JP2005225913A | 2005-08-25 |
Other References:
See also references of EP 3290479A4
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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