Title:
THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE AND PRINTED CIRCUIT BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/134951
Kind Code:
A1
Abstract:
Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.
Inventors:
FAN HUAYONG (CN)
HUANG ZENGBIAO (CN)
XU YONGJING (CN)
HUANG ZENGBIAO (CN)
XU YONGJING (CN)
Application Number:
PCT/CN2020/082467
Publication Date:
July 08, 2021
Filing Date:
March 31, 2020
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08F232/04; C08F218/02; C08F218/04; C08F232/06
Foreign References:
| CN104379553A | 2015-02-25 | |||
| CN106810820A | 2017-06-09 | |||
| CN1228410A | 1999-09-15 | |||
| CN105974734A | 2016-09-28 | |||
| KR20070072738A | 2007-07-05 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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