Title:
THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATED BOARD PREPARED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2016/074288
Kind Code:
A1
Abstract:
A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and the laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.
Inventors:
LI HUI (CN)
FANG KEHONG (CN)
FANG KEHONG (CN)
Application Number:
PCT/CN2014/092839
Publication Date:
May 19, 2016
Filing Date:
December 02, 2014
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
B32B27/04; C08L63/00; C08J5/24; C08L35/06; C08L71/12; H05K1/03
Foreign References:
| CN102964775A | 2013-03-13 | |||
| CN102942684A | 2013-02-27 | |||
| CN103709747A | 2014-04-09 | |||
| CN103351581A | 2013-10-16 | |||
| CN102585480A | 2012-07-18 |
Other References:
See also references of EP 3219758A4
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
北京品源专利代理有限公司 (CN)
北京品源专利代理有限公司 (CN)
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