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Title:
THERMOSETTING RESIN COMPOSITION, PREPREG MADE THEREFROM, COPPER CLAD LAMINATE AND HIGH-FREQUENCY CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/019463
Kind Code:
A1
Abstract:
Provided are a thermosetting resin composition, a prepreg made therefrom, a copper clad laminate and a high-frequency circuit board. Said thermosetting resin composition contains an allyl resin having a low polarity, and a phosphorus monomer-containing or phosphorus-containing resin. The copper-clad plate and the high-frequency circuit substrate thus obtained exhibit a low dielectric constant, dielectric loss, good heat resistance and flame retardancy.

Inventors:
SU, Minshe (No.5 Western Industry Road, Songshan Lake National High-Tech Industrial Development ZoneDongguan, Guangdong 8, 523808, CN)
YANG, Zhongqiang (No.5 Western Industry Road, Songshan Lake National High-Tech Industrial Development ZoneDongguan, Guangdong 8, 523808, CN)
Application Number:
CN2017/109049
Publication Date:
January 31, 2019
Filing Date:
November 02, 2017
Export Citation:
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Assignee:
SHENGYI TECHNOLOGY CO., LTD. (No.5 Western Industry Road, Songshan Lake National High-Tech Industrial Development ZoneDongguan, Guangdong 8, 523808, CN)
International Classes:
C08L61/14; C07F9/6574; C08K5/5313
Foreign References:
CN104877134A2015-09-02
CN106543228A2017-03-29
CN101544841A2009-09-30
CN101643565A2010-02-10
CN102161823A2011-08-24
US20070066739A12007-03-22
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (F6 Xijin Centre, 39 Lianhuachi East Rd. Haidian District, Beijing 6, 100036, CN)
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