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Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION AND PREPREG USING SAME, LAMINATE, AND METAL FOIL-CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2020/124673
Kind Code:
A1
Abstract:
The present invention provides a thermosetting resin composition and a prepreg using same, a laminate, and a metal foil-clad laminate. The thermosetting resin composition comprises epoxy resin, a styrene maleic anhydride oligomer, and an ester curing agent having a structure represented by formula I. According to the present invention, the ester curing agent having the structure represented by formula I and the styrene maleic anhydride oligomer are used cooperatively for curing the epoxy resin; no secondary hydroxyl or other polar groups are generated in the process of curing; moreover, a cured product contains a large amount of hydrophobic groups; high glass transition temperature of the cured product is guaranteed, and the water absorption rate, coefficient of thermal expansion and dielectric loss factor can be significantly reduced. The laminate and the metal foil-clad laminate prepared by using the thermosetting resin composition have good heat resistance, moisture resistance, peel strength, dielectric properties, and flame retardance.

Inventors:
YOU JIANG (CN)
LIN WEI (CN)
HUANG TIANHUI (CN)
Application Number:
PCT/CN2018/124717
Publication Date:
June 25, 2020
Filing Date:
December 28, 2018
Export Citation:
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Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L63/00; C08G59/42; C08L35/06
Foreign References:
CN102964775A2013-03-13
CN108864410A2018-11-23
CN106832764A2017-06-13
CN104448700A2015-03-25
EP2896654A12015-07-22
JP2009235165A2009-10-15
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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