Title:
THERMOSETTING RESIN COMPOSITION FOR SEALING SHEET-FORM ELECTRONIC COMPONENT, RESIN-SEALED SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING RESIN-SEALED SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/115725
Kind Code:
A1
Abstract:
Provided are: a thermosetting resin composition for sealing a sheet-form electronic component, the thermosetting resin composition complying with flame retardancy standard UL94 V-0 and having excellent post-curing strength; a high-reliability resin sealed semiconductor device; and a method of manufacturing a resin-sealed semiconductor device. The present invention relates to a thermosetting resin composition for sealing a sheet-form electronic component, the thermosetting resin composition having a specific silica content, compliance with flame retardancy standard UL94 V-0, and a three-point bending strength at ambient temperature following heating for 1 hour at 150°C and curing of 80 MPa or higher.
Inventors:
SHIMIZU YUSAKU (JP)
TOYODA EIJI (JP)
TOYODA EIJI (JP)
Application Number:
PCT/JP2014/051123
Publication Date:
July 31, 2014
Filing Date:
January 21, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C08L101/00; C08J3/18; C08K3/36; C08K5/5399; H01L23/29; H01L23/31
Foreign References:
| JP2004018602A | 2004-01-22 | |||
| JP2008266573A | 2008-11-06 | |||
| JP2007177071A | 2007-07-12 | |||
| JP2013006171A | 2013-01-10 | |||
| JP2013006406A | 2013-01-10 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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