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Title:
THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN SHEET, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/065704
Kind Code:
A1
Abstract:
Provided are: a thermosetting resin composition, for use in an organic material suited to high frequency use, that has outstanding low dielectric tangent, heat resistance, flexibility, and ease of workability; a thermosetting resin sheet; an electronic component; and an electronic device. The present invention is a thermosetting resin composition that includes the following constituents (A1)–(C). (A1) Polyimide resin: a polyimide resin including a diamine residue with formula (8) and/or formula (9) (in formula (8), a, b, c, and d are integers 1 or greater that meet the conditions a + b = 6–17 and c + d = 8–19, and the dashed lines denote carbon–carbon single bonds or carbon–carbon double bonds) (in formula (9), e, f, g, and h are integers 1 or greater that meet the conditions e + f = 5–16 and g + h = 8–19, and the dashed lines denote carbon–carbon single bonds or carbon–carbon double bonds). (B) Phenylene ether resin: a phenylene ether resin that has a number average molecular weight of 500–5000 and, at a terminal of a molecular chain, includes at least one cross-linked functional group selected from the group consisting of a phenolic hydroxyl group, an acryl group, a vinyl group, and an epoxy group. (C) Maleimide resin: a maleimide resin.

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Inventors:
OGASAWARA HISASHI (JP)
SHIMADA AKIRA (JP)
MATSUMURA KAZUYUKI (JP)
SAKABE YOHEI (JP)
ARAKI HITOSHI (JP)
JUKEI MASAYA (JP)
Application Number:
PCT/JP2020/036233
Publication Date:
April 08, 2021
Filing Date:
September 25, 2020
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G73/10; C08L63/00; C08L71/12; C08L79/08; C09J7/35; C09J179/08
Domestic Patent References:
WO2016056451A12016-04-14
Foreign References:
JP2010229274A2010-10-14
JP2017186551A2017-10-12
JP2015199328A2015-11-12
JP2019001875A2019-01-10
JP2014011769A2014-01-20
JP2017101152A2017-06-08
JPH06340808A1994-12-13
JP2008037915A2008-02-21
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