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Title:
THERMOSETTING RESIN COMPOSITION FOR SURFACE PROTECTION LAYERS
Document Type and Number:
WIPO Patent Application WO/2011/019003
Kind Code:
A1
Abstract:
A thermosetting resin composition characterized by comprising both a component which has an epoxy group and a curing component which contains cyclohexanetricarboxylic anhydride. A product obtained by curing the thermosetting resin composition exhibits excellent surface hardness, solvent resistance, transparency and adhesion to a substrate and is useful as a surface protection layer for a substrate.

Inventors:
SATO TAKASHI (JP)
UENO SHUICHI (JP)
Application Number:
PCT/JP2010/063409
Publication Date:
February 17, 2011
Filing Date:
August 06, 2010
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
SATO TAKASHI (JP)
UENO SHUICHI (JP)
International Classes:
C08G59/42
Domestic Patent References:
WO2005049597A12005-06-02
WO2009041389A12009-04-02
WO2008059856A12008-05-22
Foreign References:
JP2005036218A2005-02-10
JP2008063333A2008-03-21
JP2008081596A2008-04-10
JP2007039522A2007-02-15
JP2007039521A2007-02-15
JP2006182961A2006-07-13
JP2008106226A2008-05-08
JP2008133367A2008-06-12
JP2008129130A2008-06-05
JP2008120986A2008-05-29
JP2008046392A2008-02-28
Other References:
See also references of EP 2465887A4
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
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