Title:
THERMOSETTING RESIN COMPOSITION, THERMALLY CONDUCTIVE RESIN SHEET, HEAT-DISSIPATING LAYERED PRODUCT, HEAT-DISSIPATING CIRCUIT BOARD, SEMICONDUCTOR DEVICE AND POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2023/182470
Kind Code:
A1
Abstract:
This thermosetting resin composition contains a thermosetting resin, an inorganic filler and a polymer having a mass average molecular weight of 10,000 or more, and is characterized in that aggregated boron nitride particles are contained as the inorganic filler, an epoxy compound and a benzoxazine compound are contained as the thermosetting resin, and the ratio of the content by mass of the aggregated boron nitride particles relative to the content by mass of the benzoxazine compound (aggregated boron nitride particles/benzoxazine compound) is 5-50. With this thermosetting resin composition, it is possible to form a thermally conductive sheet that exhibits thermal conductivity and heat resistance, form a film without any problem when the sheet is molded, and achieve sufficient adhesive strength when the thermosetting resin composition is cured.
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Inventors:
TANAKA TOSHIYUKI (JP)
TANIGUCHI SAE (JP)
SAWAMURA TOSHIYUKI (JP)
YAMAMOTO YUMIKO (JP)
HIDAKA KATSUHIKO (JP)
TANIGUCHI SAE (JP)
SAWAMURA TOSHIYUKI (JP)
YAMAMOTO YUMIKO (JP)
HIDAKA KATSUHIKO (JP)
Application Number:
PCT/JP2023/011692
Publication Date:
September 28, 2023
Filing Date:
March 24, 2023
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08L63/00; B32B27/38; C08K3/013; C08K3/38; C08K5/3415; C08L61/34; C08L101/02; H05K1/03
Domestic Patent References:
| WO2021117758A1 | 2021-06-17 | |||
| WO2021085593A1 | 2021-05-06 |
Foreign References:
| JP2020196807A | 2020-12-10 | |||
| JP2019119883A | 2019-07-22 | |||
| JP2001288339A | 2001-10-16 | |||
| JP2015006980A | 2015-01-15 | |||
| JP2019196434A | 2019-11-14 |
Attorney, Agent or Firm:
ICHIZAWA, KAWADA & ASSOCIATES (JP)
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