Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/064992
Kind Code:
A1
Abstract:
[Problem] To provide: a thermosetting resin composition; a thermosetting resin composition for protective films; a thermosetting resin composition for planarization films; and a method for producing a cured film, a protective film or a planarization film with use of one of the above-described resin compositions. [Solution] A thermosetting resin composition which contains a polymer having a structural unit represented by formula (1), from 0% by mass to 30% by mass of a curing agent relative to the polymer, and a solvent, and wherein if a curing agent is contained therein, the curing agent is at least one compound selected from the group consisting of polyfunctional (meth)acrylate compounds and polyfunctional blocked isocyanate compounds. (In the formula, A1 represents an alkenyl group or alkynyl group having 2 or 3 carbon atoms; and A2 represents an alkenylene group or alkynylene group having 2 carbon atoms.)

Inventors:
SAKAGUCHI TAKAHIRO (JP)
SUGAWARA YUKI (JP)
ADACHI ISAO (JP)
Application Number:
PCT/JP2016/078083
Publication Date:
April 20, 2017
Filing Date:
September 23, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
C08G59/14; C08F290/14; C08F299/04; C08L67/06; C09D7/12; C09D163/10
Domestic Patent References:
WO2006115074A12006-11-02
WO2012169580A12012-12-13
WO2007015427A12007-02-08
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
Download PDF:



 
Previous Patent: JOINING COMPOSITION

Next Patent: VARIABLE DISPLACEMENT PUMP