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Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/103199
Kind Code:
A1
Abstract:
Provided in the present invention is a thermosetting resin composition, comprising phosphorus-containing active ester and epoxy resin, the phosphorus-containing active ester being copolymerised using bis-aromatic formyl chloride hydrocarbyl phosphine oxide and one of bis-hydroxyl aromatic hydrocarbyl phosphine oxide, bis-hydroxyl aromatic oxyhydrocarbyl phosphine oxide, or hydroxylated DOPO, and then obtained from aromatic formyl chloride end capping; the thermosetting resin composition provided in the present invention has the advantages of good thermal stability, humidity resistance and heat resistance, a low dielectric constant and dielectric loss tangent, a low rate of water absorption, and halogen-free flame-retardant properties, and has excellent machinability; also provided in the present invention are applications of the thermosetting resin composition for resin sheet material, resin composite metal foil, prepreg, laminated plate, metal foil-clad laminated plate, and printed circuit boards.

Inventors:
LUO CHENG (CN)
TANG GUOFANG (CN)
ZHANG JIANGLING (CN)
Application Number:
PCT/CN2017/074297
Publication Date:
June 14, 2018
Filing Date:
February 21, 2017
Export Citation:
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Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
B32B27/04; C08G59/42; B32B27/20; B32B27/38; C08G59/62; C08L63/00
Domestic Patent References:
WO2015188377A12015-12-17
Foreign References:
CN105392817A2016-03-09
CN105153234A2015-12-16
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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