Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/103276
Kind Code:
A1
Abstract:
The present invention provides a thermosetting resin composition comprising an esterified dihydroxylphenyl phosphaphenanthrene. The thermosetting resin composition has the advantages of good thermal stability, heat and humidity resistance, toughness, a low dielectric constant and tangent of dielectric loss angle, a low water absorption, and a halogen-free flame-retardant effect, etc., as well as excellent processability. The invention also provides uses of the thermosetting resin composition in resin sheet, resin composite metal foil, prepreg, laminate, metal foil cladding laminate and printed circuit board.
Inventors:
LUO CHENG (CN)
TANG GUOFANG (CN)
ZHANG JIANGLING (CN)
TANG GUOFANG (CN)
ZHANG JIANGLING (CN)
Application Number:
PCT/CN2017/085676
Publication Date:
June 14, 2018
Filing Date:
May 24, 2017
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08G59/42; C08L63/00
Foreign References:
TW201302835A | 2013-01-16 | |||
CN102070770A | 2011-05-25 | |||
CN104371320A | 2015-02-25 | |||
CN102453225A | 2012-05-16 | |||
CN101307171A | 2008-11-19 | |||
CN104086751A | 2014-10-08 | |||
CN103965587A | 2014-08-06 | |||
US20120129414A1 | 2012-05-24 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
Download PDF:
Previous Patent: SOC CHIP HAVING DEBUGGING INTERFACE SECURITY MECHANISM, AND METHOD
Next Patent: GATE VALVE HAVING INNER BUILD-UP WELDED STRUCTURE
Next Patent: GATE VALVE HAVING INNER BUILD-UP WELDED STRUCTURE