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Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/124558
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a cyanate-ester-based curable resin composition, and a molded article and prepreg in which the same is used, the cyanate-ester-based curable resin composition having a high curing rate, extremely high heat resistance, and extremely high long-term heat resistance. The present invention relates to a thermosetting resin composition including a cyanate ester compound (A) and/or an unsaturated imide compound (B), and a cyclic carbodiimide compound (C). The present invention also relates to a molded article including a cured product of such a thermosetting resin composition, and a prepreg in which a reinforcing fiber base material is impregnated with such a thermosetting resin composition.

Inventors:
SHOJI SHINICHIRO (JP)
YAMAMOTO TOMOYOSHI (JP)
Application Number:
PCT/JP2018/047382
Publication Date:
June 27, 2019
Filing Date:
December 21, 2018
Export Citation:
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Assignee:
TEIJIN LTD (JP)
International Classes:
C08L79/00; C08J5/24; C08K5/3442
Domestic Patent References:
WO2010071213A12010-06-24
WO2016039486A12016-03-17
Foreign References:
JP2016156002A2016-09-01
JP2017031402A2017-02-09
JP2015089899A2015-05-11
JP2006124494A2006-05-18
Other References:
See also references of EP 3730552A4
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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