Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/039121
Kind Code:
A2
Abstract:
Provided are: a thermosetting resin composition which has excellent workability at approximately 50°C by the viscosity thereof being lowered, and of which the obtained cured product has excellent heat resistance in high temperature regions of at least 270°C; and an article using the same. The thermosetting resin composition comprises, as essential components: a polyfunctional epoxy compound (A); a polyfunctional (meth)acryloyl compound (B); an epoxy resin curing catalyst (C); and a radical initiator (D). The mixing ratio, expressed as a mass ratio, of compound (A) and compound (B) is within the range of compound (A):compound (B)=90:10 to 10:90, inclusive.
Inventors:
ITOU TAKAHIRO (JP)
OKIMURA YUYA (JP)
HIRAKAWA MAKOTO (JP)
OKIMURA YUYA (JP)
HIRAKAWA MAKOTO (JP)
Application Number:
PCT/JP2021/029877
Publication Date:
February 24, 2022
Filing Date:
August 16, 2021
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C08G59/00; C08F2/44; C08L63/00; C09D4/02; C09D5/00; C09D163/00; C09J4/02; C09J163/00
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