THERMOSETTING RESIN, PROCESS FOR ITS PREPARATION, AND RESIN COMPOSITION CONTAINING SAME

Title:

THERMOSETTING RESIN, PROCESS FOR ITS PREPARATION, AND RESIN COMPOSITION CONTAINING SAME

Document Type and Number:

WIPO Patent Application WO/1986/002934

Kind Code:

A1

Abstract:

A thermosetting resin obtained by reacting a bis (2-oxazoline) compound, a dicarboxylic acid anhydride and, if necessary, at least one of a dicarboxylic acid, hydroxycarboxylic acid, water, and diol under heating in the presence of an electrophilic reagent has a large mechanical strength and an excellent solvent resistance. A resin composition obtained by incorporating a reinforcing material and/or a filler in the resin has excellent mechanical properties which could not have been expected for conventional fiber-reinforced plastics and has a high heat resistance, thus providing a molding composition having excellent thermal properties.

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Inventors:

SANO YASUO (JP)
MORISUE YASUHIRO (JP)
KOMIYA KIYOSHI (JP)
NAKAMURA TOSHIMASA (JP)

Application Number:

PCT/JP1984/000537

Publication Date:

May 22, 1986

Filing Date:

November 08, 1984

Export Citation:

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Assignee:

TAKEDA CHEMICAL INDUSTRIES LTD (JP)

International Classes:

C08G63/12; C08G63/00; C08G63/68; C08G63/685; C08G69/44; C08G73/02; C08K3/02; C08K3/22; C08K3/26; C08K3/34; C08K7/02; C08L77/00; C08L77/12; (IPC1-7): C08G73/00

Foreign References:

JPS4846700A

1973-07-03

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