Title:
THERMOSETTING RESIN SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/027376
Kind Code:
A1
Abstract:
This invention is provided with: a semiconductor substrate (1); a semiconductor component (2) mounted on the semiconductor substrate (1); and a thermosetting resin sheet (3) having a greater area than that of the semiconductor component (2) and having a plurality of slits (6). The slits (6) are provided to at least the entirety of the region on which the semiconductor component (2) is placed, and the surroundings thereof. The semiconductor component (2) is sealed by the thermosetting resin sheet (3) and the semiconductor substrate (1).
Inventors:
MIKI NOZOMI (JP)
OGATSU TOSHINOBU (JP)
OGATSU TOSHINOBU (JP)
Application Number:
PCT/JP2012/005148
Publication Date:
February 20, 2014
Filing Date:
August 14, 2012
Export Citation:
Assignee:
NEC CASIO MOBILE COMM LTD (JP)
MIKI NOZOMI (JP)
OGATSU TOSHINOBU (JP)
MIKI NOZOMI (JP)
OGATSU TOSHINOBU (JP)
International Classes:
H01L21/56; H01L23/29; H01L23/31
Foreign References:
| JPS63110645A | 1988-05-16 | |||
| JP2006054307A | 2006-02-23 | |||
| JPH01173731A | 1989-07-10 | |||
| JP2001028376A | 2001-01-30 | |||
| JPS58155844U | 1983-10-18 | |||
| JPS63177429A | 1988-07-21 |
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
Shinji Hayami (JP)
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