Title:
THERMOSETTING SILICONE RUBBER COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2008/082001
Kind Code:
A1
Abstract:
Disclosed is a thermosetting silicone rubber composition containing 0.001-10% by mass of a cerium oxide powder. This thermosetting silicone rubber composition is characterized in that when 0.1% by mass of the cerium oxide powder is dispersed in an alkenyl group-containing dimethylpolysiloxane raw rubber, the total light transmittance according to JIS K7105 through the resulting rubber having a thickness of 1 mm is not less than 90%. This thermosetting silicone rubber composition is excellent in thermal stability during production or in the uncured state, and enables to obtain a silicone rubber having excellent heat resistance after curing.
Inventors:
HASEGAWA CHIICHIRO (JP)
Application Number:
PCT/JP2007/075418
Publication Date:
July 10, 2008
Filing Date:
December 27, 2007
Export Citation:
Assignee:
DOW CORNING TORAY CO LTD (JP)
MIYAZAKI YOSHIAKI (JP)
HASEGAWA CHIICHIRO (JP)
MIYAZAKI YOSHIAKI (JP)
HASEGAWA CHIICHIRO (JP)
International Classes:
C08K3/22; C08L83/04; C08K5/14
Foreign References:
| JP2002179917A | 2002-06-26 | |||
| JP2000212444A | 2000-08-02 | |||
| JP2006299126A | 2006-11-02 | |||
| JP2005247904A | 2005-09-15 | |||
| JPH04300644A | 1992-10-23 | |||
| JPH01306435A | 1989-12-11 | |||
| JP2007063388A | 2007-03-15 | |||
| JP2007179047A | 2007-07-12 | |||
| JPS5214654A | 1977-02-03 | |||
| JPS60173050A | 1985-09-06 |
Other References:
See also references of EP 2105467A4
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