Title:
THERMOSOFTENING AND HEAT CONDUCTIVE SILICONE GREASE COMPOSITION, HEAT CONDUCTIVE FILM FORMATION METHOD, HEAT DISSIPATION STRUCTURE, AND POWER MODULE DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/051738
Kind Code:
A1
Abstract:
A thermosoftening and heat conductive silicone grease composition including: (A) a silicone wax having a melting point of 30-80°C; (B) a organopolysiloxane indicated by formula R1
aSiO(4-a)/2 (R1 indicating a monovalent hydrocarbon group and a being 1.8 ≤ a ≤ 2.2) and having a kinematic viscosity of 10-500,000 mm2/s at 25°C; and (C) a heat conductive filler material having a heat conductivity of at least 10 W/(m·K).
Inventors:
YAMADA KUNIHIRO (JP)
Application Number:
PCT/JP2016/076766
Publication Date:
March 30, 2017
Filing Date:
September 12, 2016
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C09K5/14; C08K3/00; C08K5/01; C08L83/04; C08L91/06; H01L23/36; H01L23/373; H05K7/20
Foreign References:
| JP2012520923A | 2012-09-10 | |||
| JP2007051227A | 2007-03-01 | |||
| JPH01115985A | 1989-05-09 |
Other References:
See also references of EP 3354707A4
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
Download PDF: