Title:
THICK COPPER CIRCUIT WITH ATTACHED PROTECTIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/059384
Kind Code:
A1
Abstract:
This thick copper circuit with attached protective material comprises: thick copper circuits; and a protective material disposed in spaces between the thick copper circuits and containing 55 vol% to 95 vol% of an inorganic filler.
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Inventors:
YAMAURA MASASHI (JP)
KAN DONCHORU (JP)
KATAGI HIDEYUKI (JP)
TAKAHASHI HIROYUKI (JP)
TOGAWA MITSUO (JP)
AMANUMA SHINJI (JP)
KAN DONCHORU (JP)
KATAGI HIDEYUKI (JP)
TAKAHASHI HIROYUKI (JP)
TOGAWA MITSUO (JP)
AMANUMA SHINJI (JP)
Application Number:
PCT/JP2018/035213
Publication Date:
March 28, 2019
Filing Date:
September 21, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H05K1/03; C08G59/24; C08K3/00; C08L63/00; H01L23/12; H05K3/20
Domestic Patent References:
| WO2016104788A1 | 2016-06-30 | |||
| WO2018189797A1 | 2018-10-18 |
Foreign References:
| JP2003249742A | 2003-09-05 | |||
| JP2017101257A | 2017-06-08 | |||
| JP2012089681A | 2012-05-10 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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