Title:
THICK FILM CONDUCTOR COMPOSITIONS FOR USE ON ALUMINUM NITRIDE SUBSTRATES
Document Type and Number:
WIPO Patent Application WO2003031373
Kind Code:
A3
Abstract:
The invention is directed to a conductive thick film composition for use on an aluminum nitride substrate that utilizes a boron containing reactant and a metal oxide to promote adhesion.
Inventors:
WANG YUELI (US)
CARROLL ALAN FREDERICK (US)
CARROLL ALAN FREDERICK (US)
Application Number:
PCT/US2002/033469
Publication Date:
August 21, 2003
Filing Date:
October 08, 2002
Export Citation:
Assignee:
DU PONT (US)
WANG YUELI (US)
CARROLL ALAN FREDERICK (US)
WANG YUELI (US)
CARROLL ALAN FREDERICK (US)
International Classes:
C04B41/51; C04B41/88; H01L23/15; H01B1/22; H01L23/498; H05K1/09; (IPC1-7): C04B41/51; H05K1/09; H01L23/498
Foreign References:
EP0913371A2 | 1999-05-06 | |||
US3929674A | 1975-12-30 | |||
US4322316A | 1982-03-30 | |||
US6103146A | 2000-08-15 |
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