Title:
THICK LAYER POLYIMIDE METAL CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2012/053826
Kind Code:
A1
Abstract:
Provided is a thick layer polyimide metal clad laminate, and more particularly, a thick layer polyimide metal clad laminate for producing a product with excellent process stability and superior dimensional stability. Specifically, the present invention is directed to providing a thick layer polyimide metal clad laminate, in which a polyimide laminate and a metal foil, which is on one side or both sides of the polyimide laminate, are attached by a lamination process, wherein the polyimide laminate includes a polyimide film and a thermoplastic polyimide layer formed on one side or both sides of the polyimide film, the polyimide film having an elongation of 30% or less, and a tensile modulus of 3GPa or more, which is measured by IPC-TM-650 (2.4.19) method, and a coefficient of thermal linear expansion (CTE) of 5 to 30ppm/℃, which is calculated from 100 to 250℃.
Inventors:
KIM HO SUB (KR)
KIM DAE NYOUN (KR)
JUNG SEUNG HOON (KR)
JO BYOUNG WOOK (KR)
KIM YOUNG DO (KR)
CHOI WEON JUNG (KR)
KIM DAE NYOUN (KR)
JUNG SEUNG HOON (KR)
JO BYOUNG WOOK (KR)
KIM YOUNG DO (KR)
CHOI WEON JUNG (KR)
Application Number:
PCT/KR2011/007799
Publication Date:
April 26, 2012
Filing Date:
October 19, 2011
Export Citation:
Assignee:
SK INNOVATION CO LTD (KR)
KIM HO SUB (KR)
KIM DAE NYOUN (KR)
JUNG SEUNG HOON (KR)
JO BYOUNG WOOK (KR)
KIM YOUNG DO (KR)
CHOI WEON JUNG (KR)
KIM HO SUB (KR)
KIM DAE NYOUN (KR)
JUNG SEUNG HOON (KR)
JO BYOUNG WOOK (KR)
KIM YOUNG DO (KR)
CHOI WEON JUNG (KR)
International Classes:
B32B15/08; B32B37/00
Foreign References:
| US20090197068A1 | 2009-08-06 | |||
| US20070098910A1 | 2007-05-03 | |||
| US20070009710A1 | 2007-01-11 | |||
| US4705720A | 1987-11-10 |
Attorney, Agent or Firm:
KWON, Oh-Sig et al. (921 Dunsan-dong Seo-gu, Daejeon 302-120, KR)
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Claims: