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Patent Searching and Data


Title:
THICK STEEL PLATE MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/115277
Kind Code:
A1
Abstract:
Disclosed is a thick steel plate manufacturing device that is able to spray water on a thick steel plate on a conveyor line. Specifically disclosed is a thick steel plate manufacturing device equipped with at least a roller, a hot leveller and a conveyor line composing a table roller that conveys thick rolled steel plate from the roller to the hot leveller and having water spraying devices that are provided along the conveyor line at positions thereabove and therebelow and spraying water on both sides of the steel plate. Said thick steel plate manufacturing device further comprising a platform that stretches across the conveyor line at a separate site downstream from the roller, cooling headers provided on the platform and connected to water pipes, and a roller exit-side water spray device that has multiple cooling nozzles that spray water at a designated pressure in the roller direction and are arranged on the cooling header in a row that crosses the conveyor line. The disclosed device further comprises a hot-leveller entrance-side water spray device in which multiple cooling nozzles for spraying water in the direction of the conveyor line are arranged along the conveyor line upstream of the hot leveller at positions above and to the outside of the conveyor line in the lengthwise direction.

Inventors:
AGARIO, Hidetaka (6-1 Marunouchi 2-chome, Chiyoda-k, Tokyo 71, 〒1008071, JP)
上尾 英孝 (〒71 東京都千代田区丸の内二丁目6番1号新日本製鐵株式会社内 Tokyo, 〒1008071, JP)
Application Number:
JP2011/056675
Publication Date:
September 22, 2011
Filing Date:
March 15, 2011
Export Citation:
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Assignee:
NIPPON STEEL CORPORATION (6-1 Marunouchi 2-chome, Chiyoda-ku Tokyo, 71, 〒1008071, JP)
新日本製鐵株式会社 (〒71 東京都千代田区丸の内二丁目6番1号 Tokyo, 〒1008071, JP)
AGARIO, Hidetaka (6-1 Marunouchi 2-chome, Chiyoda-k, Tokyo 71, 〒1008071, JP)
International Classes:
B21B45/02; B21B1/38
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg. 5-1, Toranomon 3-chome, Minato-k, Tokyo 23, 〒1058423, JP)
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Claims: