THICKENING AGENT, THICKENING COMPOSITION AND PROCESS FOR PRODUCING THE SAME, SHEET MOLDING COMPOUND OR BULK MOLDING COMPOUND AND PROCESS FOR PRODUCING THE SAME, AND MOLDED RESIN AND PROCESS FOR PRODUCING THE SAME

Title:

Document Type and Number:

WIPO Patent Application WO/2001/098429

Kind Code:

A1

Abstract:

A thickening agent which comprises an inorganic filler (F) and a syrup (S) comprising a polymer having functional groups reactive with the inorganic filler (F); a sheet molding compound (SMC) or bulk molding compound (BMC) which each contains an inorganic filler (F) containing the oxide or hydroxide of a divalent metal and a syrup (S) comprising a polymer having functional groups reactive with the inorganic filler (F), the amount of the oxide or hydroxide being 0.6 wt.% or smaller based on the whole syrup (S); a process for producing a molded resin which comprises curing the SMC or BMC with heating and pressing; and a thickening composition characterized by containing a compound (A) having two or more acid groups per molecule and a compound (B) having two or more basic groups per molecule.

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Inventors:

KOYANAGI SEIYA (JP)
YONEKURA KATSUMI (JP)
KISHIMOTO YUICHIRO (JP)
YANASE AKITADA (JP)
KAZEHAYA YUUJI (JP)

Application Number:

PCT/JP2001/005351

Publication Date:

December 27, 2001

Filing Date:

June 22, 2001

Export Citation:

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Assignee:

MITSUBISHI RAYON CO (JP)
KOYANAGI SEIYA (JP)
YONEKURA KATSUMI (JP)
KISHIMOTO YUICHIRO (JP)
YANASE AKITADA (JP)
KAZEHAYA YUUJI (JP)

International Classes:

C04B26/04; C08K9/08; C09K3/00; (IPC1-7): C09K3/00; B29C43/02; C04B26/04; C08J5/04; C08K3/00; C08K5/00; C08L101/00

Foreign References:

JPH11140141A	1999-05-25
JP2000154297A	2000-06-06
JPH10287788A	1998-10-27
JP2000129066A	2000-05-09
JP2000143927A	2000-05-26
JP2000044759A	2000-02-15
JPH06313019A	1994-11-08
JPS5731912A	1982-02-20
US4948546A	1990-08-14
EP0389427A2	1990-09-26

Attorney, Agent or Firm:

Kaneda, Nobuyuki (16th Kowa Bldg. 9-20 Akasaka 1-chome Minato-ku, Tokyo, JP)

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