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Patent Searching and Data


Title:
THICKNESS MEASURING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/008851
Kind Code:
A1
Abstract:
A thickness measuring apparatus according to an embodiment of the present invention may comprise: a light emission unit for irradiating light to an object; a lens unit for collecting light generated in the light emission unit; a lattice pattern generation unit through which light collected through the lens unit passes; a light reception unit for receiving light reflected from multiple interlayer boundaries of the object; and a calculation unit for obtaining a thickness of at least one of multiple layers of the object on the basis of a difference in height between lattice patterns which are formed on a surface of the object by the lattice pattern generation unit.

Inventors:
BAE JINHYEONG (KR)
Application Number:
PCT/KR2017/005663
Publication Date:
January 11, 2018
Filing Date:
May 31, 2017
Export Citation:
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Assignee:
LG ELECTRONICS INC (KR)
International Classes:
G01B11/06; G01B9/02
Foreign References:
KR20160002104A2016-01-07
KR20120100064A2012-09-12
JP2015090315A2015-05-11
KR101544968B12015-08-19
JP2013029342A2013-02-07
Attorney, Agent or Firm:
KIM, Ki Moon (KR)
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