Title:
THIN CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/081867
Kind Code:
A1
Abstract:
A thin circuit board (100) and a manufacturing method therefor. The thin circuit board (100) comprises: a dielectric layer (40); an inner layer circuit substrate (30); and a metal layer (50) provided on at least one side of the inner layer circuit substrate (30). The metal layer (50) is covered by the dielectric layer (40), the dielectric layer (40) comprises an insulation layer (11) located at the outermost side and a bonding structure (20) sandwiched between the inner layer circuit substrate (30) and the metal layer (50), and the metal layer (50) is covered by the insulation layer (11) and the bonding structure (20).
Inventors:
HSU HSIAOTING (CN)
HO MINGJAAN (CN)
SHEN FUYUN (CN)
HU XIANQIN (CN)
HO MINGJAAN (CN)
SHEN FUYUN (CN)
HU XIANQIN (CN)
Application Number:
PCT/CN2019/114604
Publication Date:
May 06, 2021
Filing Date:
October 31, 2019
Export Citation:
Assignee:
AVARY HOLDING SHENZHEN CO LTD (CN)
QING DING PREC ELECTRONICS HUAIAN CO LTD (CN)
QING DING PREC ELECTRONICS HUAIAN CO LTD (CN)
International Classes:
H05K1/02
Foreign References:
| CN107666764A | 2018-02-06 | |||
| CN207733057U | 2018-08-14 | |||
| CN109661125A | 2019-04-19 | |||
| CN104159392A | 2014-11-19 | |||
| CN103582322A | 2014-02-12 | |||
| US20090310323A1 | 2009-12-17 |
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO.,LTD. (CN)
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