Title:
THIN FILM CAPACITOR AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/021001
Kind Code:
A1
Abstract:
In the present invention, a plurality of first capacitors 2a and second capacitors 2b are formed on two main surfaces of a foil-like conductive substrate 1 so as to sandwich the conductive substrate 1. The first capacitors 2a and second capacitors 2b are respectively covered by protective layers 3a, 3b made from an insulating material, and terminal electrodes 4a, 4b are formed respectively on the main surfaces of the protective layers 3a, 3b. The terminal electrodes 4a, 4b and the respective conductive parts 5a, 5b of the first capacitors 2a and second capacitors 2b are electrically connected via first via conductors 6a, 6b, and the terminal electrodes 4a, 4b and the conductive substrate 1 are electrically connected to second conduction vias 7a, 7b. Due to this configuration, it is possible to realize: a small-sized and high-capacity thin film capacitor that is easy to use, has high flexibility in design and can be used in various applications; and an electronic device using such thin film capacitor.
Inventors:
FUJII YASUO (JP)
SAEKI HIROMASA (JP)
SAEKI HIROMASA (JP)
Application Number:
PCT/JP2017/025157
Publication Date:
February 01, 2018
Filing Date:
July 10, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G9/04; H01G4/33; H01L23/12; H05K3/46
Foreign References:
| JP2007173439A | 2007-07-05 | |||
| JP2006245588A | 2006-09-14 | |||
| JP2008177576A | 2008-07-31 |
Attorney, Agent or Firm:
KUNIHIRO Yasutoshi (JP)
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