Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THIN FILM CAPACITOR AND METHOD FOR MANUFACTURING THIN FILM CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2007/010681
Kind Code:
A1
Abstract:
Disclosed is a thin film capacitor comprising a capacitor unit formed on a substrate in which capacitor unit a first conductor layer and a second conductor layer are formed opposite to each other via a dielectric thin film; a first conductor pad which is electrically connected with one of the first and second conductor layers while being electrically insulated from the other conductor layer; a second conductor pad which is electrically insulated from the one conductor layer while being electrically connected with the other conductor layer; and first and second bumps respectively formed on the first conductor pad and the second conductor pad. In this thin film capacitor, the first and second conductor pads are joined to the substrate. By having such a constitution, even when a stress occurs in a bump in the vertical direction, the stress does not concentrate on a conductor.

Inventors:
TAKESHIMA YUTAKA (JP)
NOMURA MASANOBU (JP)
Application Number:
PCT/JP2006/311306
Publication Date:
January 25, 2007
Filing Date:
June 06, 2006
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MURATA MANUFACTURING CO (JP)
TAKESHIMA YUTAKA (JP)
NOMURA MASANOBU (JP)
International Classes:
H01G4/33; H01G4/12; H01L21/768; H01L21/82; H01L21/822; H01L23/12; H01L27/04
Foreign References:
JP2003197463A2003-07-11
JP2001217143A2001-08-10
JP2005159259A2005-06-16
JP2004214589A2004-07-29
Attorney, Agent or Firm:
KUNIHIRO, Yasutoshi (14-10 Nishinakajima 5-chome, Yodogawa-k, Osaka-shi Osaka 11, JP)
Download PDF: