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Patent Searching and Data


Title:
THIN FILM CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2016/158228
Kind Code:
A1
Abstract:
[Problem] To provide a thin film capacitor having a high manufacturing efficiency. [Solution] A thin film capacitor 100 is provided with: a supporting substrate 110; a capacitor forming section 140, which is formed on the supporting substrate 110, and which is configured by alternately laminating first thin film electrode layers 121, second thin film electrode layers 122, and thin film dielectric bodies 130; a first external electrode 161 that is electrically connected to the first thin film electrode layers 121; and a second external electrode 162 that is electrically connected to the second thin film electrode layers 122. In connecting regions between the first and second thin film electrode layers 121, 122, and the first and second external electrodes 161, 162, the first thin film electrode layers 121 and the second thin film electrode layers 122 are formed step-like in cross-section so that the first and second thin film electrode layers are exposed from planes parallel to the supporting substrate 110.

Inventors:
KUROSAWA Masaru (LTD. 16-20UENO 6-chom, Taito-ku Tokyo 05, 〒1100005, JP)
SASAJIMA Yuichi (LTD. 16-20UENO 6-chom, Taito-ku Tokyo 05, 〒1100005, JP)
SHIMADA Takashi (LTD. 16-20UENO 6-chom, Taito-ku Tokyo 05, 〒1100005, JP)
Application Number:
JP2016/057051
Publication Date:
October 06, 2016
Filing Date:
March 08, 2016
Export Citation:
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Assignee:
TAIYO YUDEN CO.,LTD. (16-20, UENO 6-chomeTaito-ku Tokyo, 05, 〒1100005, JP)
International Classes:
H01G4/33; H01G4/12
Foreign References:
JP2013229583A2013-11-07
JP2008243931A2008-10-09
JP2007173386A2007-07-05
JPS466227B
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