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Title:
THIN FILM COMPOSITE MATERIAL, METHOD FOR PRODUCING SAME, AND MULTILAYER WIRING BOARD AND ELECTRONIC COMPONENT USING SUCH THIN FILM COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2005/080074
Kind Code:
A1
Abstract:
Disclosed is a metal oxide thin film composite material which is excellent in adhesion to a metal layer formed thereon by plating and is hardly corroded by the plating solution. The thin film composite material comprises a copper foil with a metal thin film whose surface is provided with a dielectric thin film having such a structure wherein at least an amorphous metal oxide thin film layer containing Ti as an constituent element is included as the outermost layer.

Inventors:
KONDOU YUUSUKE
HIRATA YOSHITAKA
SHIMADA YASUSHI
KUMASHIRO YASUSHI
Application Number:
PCT/JP2005/001673
Publication Date:
September 01, 2005
Filing Date:
February 04, 2005
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
KONDOU YUUSUKE
HIRATA YOSHITAKA
SHIMADA YASUSHI
KUMASHIRO YASUSHI
International Classes:
B32B9/00; H01B17/60; H01G4/12; H01G4/33; H05K1/16; H05K3/38; (IPC1-7): B32B9/00; H01B17/60; H01G4/12; H01G4/33; H05K1/16
Foreign References:
JP2002009416A2002-01-11
JP2000208363A2000-07-28
Attorney, Agent or Firm:
Miyoshi, Hidekazu (2-8 Toranomon 1-chome, Minato-k, Tokyo 01, JP)
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