Title:
THIN FILM ELEMENT, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/073350
Kind Code:
A1
Abstract:
This thin film element (101) is provided with: a substrate (1); a wiring conductor film (2) formed on the surface of the substrate (1); a protective film (3) which coats at least the surface of the wiring conductor film (2); an external electrode (4); and a first resist film (11) and a second resist film (12) which coat the surface of the protective film (3). The protective film (3) has a contact hole (CH1) provided in a position which overlaps the wiring conductor film (2) when viewed from the (Z) direction. The external electrode (4) is formed inside the contact hole (CH1) and on the surface of the wiring conductor film (2). The external electrode (4) is thicker than the protective film (3), and has a side surface (S1). The first resist film (11) is in contact with the entire circumference of the side surface (S1) of the external electrode (4). The second resist film (12) is disposed away from the first resist film (11) and the side surface (S1) of the external electrode (4).
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Inventors:
NAKAISO TOSHIYUKI (JP)
Application Number:
PCT/JP2016/080467
Publication Date:
May 04, 2017
Filing Date:
October 14, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L21/60
Foreign References:
| JP2010267641A | 2010-11-25 | |||
| JP2003124389A | 2003-04-25 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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