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Patent Searching and Data


Title:
THIN-FILM ENCAPSULATION METHOD FOR OLED DEVICE, AND OLED DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/144518
Kind Code:
A1
Abstract:
Provided are a thin-film encapsulation method for an OLED device, and an OLED device. The method comprises: providing an OLED device to be encapsulated; and forming, by means of a photoetching patterning technology, inorganic films and organic films in an alternating manner on the OLED device to be encapsulated, so as to carry out thin film encapsulation on the OLED device. The steps of forming the inorganic films and the organic films respectively comprise: forming a photoresist layer encircling a light-emitting layer of the OLED device to be encapsulated, on the OLED device to be encapsulated, and forming inorganic films/organic films in an open area of the photoresist layer. By means of the method, a shadow effect caused by a photomask can be avoided, a problem of ink overflow at a boundary can also be solved, and a requirement of a device for a narrow frame can be satisfied effectively.

Inventors:
PENG SIMIN (CN)
JIN JIANGJIANG (CN)
HSU HSIANG-LUN (CN)
Application Number:
PCT/CN2018/083361
Publication Date:
August 01, 2019
Filing Date:
April 17, 2018
Export Citation:
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Assignee:
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
H01L51/52; H01L27/32
Foreign References:
CN106711354A2017-05-24
CN105190932A2015-12-23
CN103715366A2014-04-09
US20040229051A12004-11-18
CN107403877A2017-11-28
CN102903728A2013-01-30
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
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