Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THIN FILM FORMING APPARATUS AND METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2006/043343
Kind Code:
A1
Abstract:
A utilization ratio of a target material, a tact time, maintenance easiness and film forming accuracy are improved by a thin film forming apparatus. The thin film forming apparatus is provided with a vacuum chamber, a sputter cathode for holding the target material, a placing means for placing a substrate to be deposited with the sputtered target material and a carrying mechanism for the placing means. In the carrying mechanism, a carrying path is provided so as to permit the substrate pass through the front side of the target material, and the placing means is composed of a substrate tray which can hold a plurality of substrates in juncture.

Inventors:
FUJIWARA TAKAYUKI (JP)
NAGAI KAZUYOSHI (JP)
Application Number:
PCT/JP2005/000853
Publication Date:
April 27, 2006
Filing Date:
January 24, 2005
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHOWA SHINKU KK (JP)
FUJIWARA TAKAYUKI (JP)
NAGAI KAZUYOSHI (JP)
International Classes:
C23C14/34; H01L41/09; H01L41/18; H01L41/22; H01L41/29; H03H3/02; (IPC1-7): C23C14/34; H01L41/09; H01L41/18; H01L41/22; H03H3/02
Foreign References:
JPH08232062A1996-09-10
JPH10158835A1998-06-16
JP7054284Y2
JP2911797B21999-06-23
JPH06108241A1994-04-19
JP2603209Y22000-03-06
JP2001057449A2001-02-27
JPH0649639A1994-02-22
Attorney, Agent or Firm:
Okabe, Masao (Fuji Bldg. 2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo, JP)
Download PDF:



 
Previous Patent: CORE YARN SEWING THREAD

Next Patent: SURFACE ILLUMINATOR