THIN FILM FORMING APPARATUS AND THIN FILM FORMING METHOD

Title:

THIN FILM FORMING APPARATUS AND THIN FILM FORMING METHOD

Document Type and Number:

WIPO Patent Application WO/2008/029622

Kind Code:

A1

Abstract:

Provided are a thin film forming apparatus and a thin film forming method wherein an atmospheric pressure plasma discharge is employed and floating fine particles are not mixed while a film is being formed of a base material by adjusting a gas flow resistance and supply and exhaust flow quantities. The flow resistance that a treatment gas receives at a time of passing through a coating space section between a treatment gas ejecting means and surfaces of a pair of roll electrodes is larger than a flow resistance that the treatment gas receives at a time of passing through a gap between the pair of roll electrodes. A gas exhaust flow quantity at the treatment gas ejecting means and that at the exhaust gas ejecting means are larger than a gas supply flow quantity at the treatment gas ejecting means.

Inventors:

YAMASHITA, Daishi (Inc. 1 Sakura-machi, Hino-sh, Tokyo 11, 1918511, JP)
山下大志 (〒11 東京都日野市さくら町１番地コニカミノルタテクノロジーセンター株式会社内 Tokyo, 1918511, JP)
KUDO, Ichiro (Inc. 1 Sakura-machi, Hino-sh, Tokyo 11, 1918511, JP)

Application Number:

JP2007/066255

Publication Date:

March 13, 2008

Filing Date:

August 22, 2007

Export Citation:

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Assignee:

Konica Minolta Holdings, Inc. (6-1 Marunouchi 1-chome, Chiyoda-ku Tokyo, 05, 1000005, JP)
コニカミノルタホールディングス株式会社 (〒05 東京都千代田区丸の内一丁目６番１号 Tokyo, 1000005, JP)
YAMASHITA, Daishi (Inc. 1 Sakura-machi, Hino-sh, Tokyo 11, 1918511, JP)
山下大志 (〒11 東京都日野市さくら町１番地コニカミノルタテクノロジーセンター株式会社内 Tokyo, 1918511, JP)