Title:
THIN FILM FORMING METHOD AND THIN FILM FORMING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2013/011775
Kind Code:
A1
Abstract:
In the present invention, an operation of landing a droplet of a thin film material on an edge of a substrate surface region where a thin film pattern is to be formed, and an operation of hardening the thin film material thus landed are repeated, thereby forming an edge pattern composed of the thin film material at the edge of the region where the thin film pattern is to be formed. A droplet of the thin film material is landed on an inner region having the edge thereof demarcated by the edge pattern. The thin film material landed on the inner region is hardened. The thin film pattern composed of the edge pattern and the thin film material landed on the inner region is formed.
Inventors:
ISO KEIJI (JP)
OKAMOTO YUJI (JP)
ICHIKAWA EIJI (JP)
OKAMOTO YUJI (JP)
ICHIKAWA EIJI (JP)
Application Number:
PCT/JP2012/065024
Publication Date:
January 24, 2013
Filing Date:
June 12, 2012
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
ISO KEIJI (JP)
OKAMOTO YUJI (JP)
ICHIKAWA EIJI (JP)
ISO KEIJI (JP)
OKAMOTO YUJI (JP)
ICHIKAWA EIJI (JP)
International Classes:
H05K3/28; B05C5/00; B05C9/12; B05D1/26; B05D3/06
Domestic Patent References:
| WO2010064533A1 | 2010-06-10 |
Foreign References:
| JP2006212476A | 2006-08-17 | |||
| JP2004237724A | 2004-08-26 | |||
| JP2011025164A | 2011-02-10 |
Attorney, Agent or Firm:
KITAYAMA, Mikio (JP)
Mikio Kiyama (JP)
Mikio Kiyama (JP)
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Claims:
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