THIN FILM MANUFACTURING METHOD, THIN FILM MANUFACTURING APPARATUS, PHOTOELECTRIC CONVERSION ELEMENT MANUFACTURING METHOD, LOGIC CIRCUIT MANUFACTURING METHOD, LIGHT-EMITTING ELEMENT MANUFACTURING METHOD, AND LIGHT CONTROL ELEMENT MANUFACTURING METHOD

Title:

Document Type and Number:

WIPO Patent Application WO/2017/208826

Kind Code:

A1

Abstract:

[Problem] To provide a thin film manufacturing method, a thin film manufacturing apparatus, a photoelectric conversion element manufacturing method, a logic circuit manufacturing method, a light-emitting element manufacturing method, and a light control element manufacturing method with which layer number control and heterogeneous lamination film formation are possible. [Solution] This thin film manufacturing method: brings an electrically conductive object on which a film is to be formed into contact with a first terminal and a second terminal and applies a voltage across the first terminal and the second terminal to heat a first region, which is the region of the object on which a film is to be formed between the first terminal and the second terminal; and forms a thin film in the first region by supplying a film-forming feedstock to the first region and controlling the reaction time so that a thin film with the intended number of layers is formed.

Inventors:

KADONO KOJI (JP)
IMAIZUMI SHINJI (JP)

Application Number:

PCT/JP2017/018560

Publication Date:

December 07, 2017

Filing Date:

May 17, 2017

Export Citation:

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Assignee:

SONY CORP (JP)

International Classes:

C23C16/46; C01B21/064; C01G39/06; C23C14/56; H01L21/205; H01L21/285

Foreign References:

JP2002129321A	2002-05-09
JP2011174097A	2011-09-08
JP2012144783A	2012-08-02
JPS57134558A	1982-08-19
JPH11140204A	1999-05-25
JPH1171665A	1999-03-16

Attorney, Agent or Firm:

OMORI, Junichi (JP)

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